代码

相关对象

说明

单一字符代码

L

Line

走线

P

Pin

元件脚

V

Via

贯穿孔

K

Keep in/out

允许区域/禁止区域

C

Component

元件层级

E

Electrical Constraint

电气约束

J

T-Junction

呈现T形的走线

I

Island Form

被Pin或Via围成的负片孤铜

错误代码前置码说明

W

Wire

与走线相关的错误

D

Design

与整个电路板相关的错误

M

Soldemask

与防焊层相关的错误

错误代码后置码说明

S

Shape/Stub

与走线层的Shape或分支相关的错误

N

Not  Allowed

与不允许的设置相关的错误

W

Width

与宽度相关的错误

双字符错误代码

BB

Bondpad to Bondpad

Bondpad之间的错误

BL

Bondpad to Line

Bondpad与Line之间的错误

BS

Bondpad to Shape

Bondpad与Shape 之间的错误

CC

Package to Package

Package之间的 Spacing 错误

Symbol Soldermask to Symbol

Soldermask零件防焊层之间的Spacing 错误

DF

Differential Pair Length Tolerance

差分对走线的长度误差过长

Differential Pair Primary Max Separation

差分对走线的主要距离太大

Differential Pair Secondary Max Separation

差分对走线的次要距离太大

Differential Pair Secondary Max Length

差分对走线的次要距离长度过长

DI

Design Constraint Negative Plane Island

负片孤铜的错误

ED

Propagation-Delay

走线的长度错误

Relative-Propagation-Delay

走线的等长错误

EL

Max Exposed Length

走线在外层（TOP&BOTTOM）的长度过长

EP

Max Net Parallelism Length-Distance Pair

已超过Net之间的平行长度

ES

Max Stub Length

走线的分支过长

ET

Electrical Topology

走线连接方式的错误

EV

Max Via Count

已超过走线使用的VIA的最大数目

EX

Max Crosstalk

已超过Crosstalk值

Max Peak Crosstalk

已超过Peak Crosstalk值

HH

Hold to Hold Spacing

钻孔之间的距离太近

HW

Diagonal Wire to Hold Spacing

斜线与钻孔之间的距离太近

Hold to Orthogonal Wire Spacing

钻孔与垂直/水平线之间的距离太近

IM

Impedance Constraint

走线的阻抗值错误

JN

T Junction Not Allowed

走线呈T形的错误

KB

Route Keepin  to Bondpad

Bondpad在Keepin之外

Route keepout  to Bondpad

Bondpad在keepout之内

Via Keepout  to  Bondpad

Bondpad在Via Keepout之内

KC

Package to Place Keepin Spacing

元件在Place Keepin之外

Package to Place Keepout Spacing

元件在Place Keepout之内

KL

Line to Route Keepin Spacing

走线在Route Keepin之外

Line to Route Keepout Spacing

走线在Route Keepout之内

KS

Shape to Route Keepin Spacing

Shape在Route Keepin之外

Shape to Route Keepout Spacing

Shape在Route Keepout之内

KV

BBVia to Route Keepin Spacing

BBVia在Route Keepin之外

BBVia to Route Keepout Spacing

BBVia在Route Keepout之内

BBVia to Via Keepout Spacing

BBVia在Via Keepout之内

Test Via to Route Keepin Spacing

Test Via在Route Keepin之外

Test Via to Route Keepout Spacing

Test Via在Route Keepout之内

Test Via to Via Keepout Spacing

Test Via在Via Keepout之内

Through Via to Route Keepin Spacing

Through Via在Route Keepin之外

Through Via to Route Keepout Spacing

Through Via在Route Keepout之内

Through Via to Via Keepout Spacing

Through Via在Via Keepout之内

LB

Min Self Crossing Loopback Length

无

LL

Line to Line Spacing

走线之间太近

LS

Line to Shape Spacing

走线与Shape 太近

LW

Min Line Width

走线的宽度太细

Min Neck Width

走线变细的宽度太细

MA

Soldermask Alignment Error Pad

Soldermask Tolerance太小

MC

Pin/Via Soldermask to Symbol Soldermask

Pad与Symbol Soldermask之间的错误

MM

Pin/Via Soldermask to Pin/Via Soldermask

Pad  Soldermask之间的错误

PB

Pin to Bondpad

Pin与Bondpad之间的错误

PL

Line to SMD Pin Spacing

走线与SMD元件脚太近

Line to Test Pin Spacing

走线与Test元件脚太近

Line to Through Pin Spacing

走线与Through元件脚太近

PP

SMD Pin to SMD Pin Spacing

SMD元件脚与SMD元件脚太近

SMD Pin to Test Pin Spacing

SMD元件脚与Test元件脚太近

Test Pin to Test Pin Spacing

Test元件脚与Test元件脚太近

Test Pin to Through Pin Spacing

Test元件脚与Through元件脚太近

Through Pin to SMD Pin Spacing

Through元件脚与SMD元件脚太近

Through Pin to Through Pin Spacing

Through元件脚与Through元件脚太近

PS

Shape to SMD Pin Spacing

Shape与SMD元件脚太近

Shape to Test Pin Spacing

Shape与Test元件脚太近

Through Pin to Shape Spacing

Through元件脚与Shape太近

PV

BBVia to SMD Pin Spacing

BBVia与SMD元件脚太近

BBVia to Test Pin Spacing

BBVia与Test元件脚太近

BBVia to Through Pin Spacing

BBVia 与Through元件脚太近

SMD Pin to Test Via Spacing

SMD Pin与Test Via太近

SMD Pin to Through Via Spacing

SMD Pin与Through Via太近

Test Pin to Test Via Spacing

Test Pin与Test Via太近

Test Pin to Through Via Spacing

Test Pin与Through Via太近

Test Via to Through Pin Spacing

Test Via与Through Pin太近

Through Pin to Through Via Spacing

Through Pin与Through Via太近

RC

Package to Hard Room

元件在其他的Room之内

RE

Min Length Route End Segment at 135Degree

无

Min Length Route End Segment at 45/90Degree

无

 SB

135Degree Turn to Adjacent Crossing Distance

无

90Degree Turn to Adjacent Crossing Distance

无

SL

Min Length Wire Segment

无

Min Length Single Segment Wire

无

SN

Allow on Etch Subclass

允许在走线层上

SO

Segment Orientaion

无

BB

Bondpad to Bondpad

Bondpad之间的错误

SS

Shape to Shape

Shape之间的错误

TA

Max Turn Angle

无

VB

Via to Bondpad

Via 与Bondpad之间的错误

VG

Max BB Via Stagger Distance

同一段线的BB Via之间的距离太长

Min BB Via Gap

BB Via之间太近

Min BB Via Stagger Distance

同一段线的BB Via之间的距离太近

Pad/Pad Direct Connect

Pad 在另一个Pad 之上

VL

BB Via to Line Spacing

BB Via与走线太近

Line to Through Via Spacing

走线与Through Via太近

Line to Test Via Spacing

走线与Test Via太近

VS

BB Via to Shape Spacing

BB Via与Shape太近

Shape to Test Via Spacing

Shape 与Test Via太近

Shape to Through Via Spacing

Shape与Through Via太近

VV

BB Via to BB Via  Spacing

BB Via之间太近

BB Via to Test Via Spacing

BB Via与Test Via太近

BB Via to Through Via Spacing

BB Via与Through Via太近

Test Via to Test Via Spacing

Test Via之间太近

Test Via to Through Via Spacing

Test Via与Through Via太近

Through Via to Through Via Spacing

Through Via之间太近

WA

Min Bonding Wire Length

Bonding Wire 长度太短

WE

Min End Segment Length

无

Min Length Wire End Segment at 135Degree

无

Min Length Wire End Segment at 45/90Degree

无

WI

Max Bonding Wire Length

Bonding Wire 长度太长

WW

Diagonal Wire to Diagonal Wire Spacing

斜线之间太近

Diagonal Wire to Orthogonal Wire Spacing

斜线与垂直/水平线之间的距离太近

Orthogonal Wire to Orthogonal Wire Spacing

垂直/水平线之间的距离太近

WX

Max Number of Crossing

无

Min Distance between Crossing

无

XB

135 Degree Turn to Adjacent Crossing Distance

无

90 Degree Turn to Adjacent Crossing Distance

无

XD

Externally Determined Violation

无

XS

Crossing to Adjacent Segment Distances

无