集成电路/微电子/电子科学与技术在IEEE上可以参考的期刊会议总结

1.会议

IEEE International Solid-State Circuits Conference，简称：ISSCC，国际固态电路会议
（顶会，每年仅有200篇左右）

IEEE International Electron Devices Meeting，简称：IEDM，国际电子器件会议

IEEE Symposia on VLSI Technology and Circuits，简称：VLSI，超大规模集成电路研讨会

European Solid-State Circuit Conference，简称：ESSCIRC，欧洲固态电路会议

IEEE Asian Solid-State Circuits Conference，简称：A-SSCC，亚洲固态电路会议

Hot Chips: A Symposium on High Performance Chips，简称：Hot Chips，高性能芯片研讨会

IEEE International Symposium on Circuits and Systems，简称：ISCAS，电路系统研讨会

IEEE/ACM International Symposium on Microarchitecture，简称：MICRO，微架构

International Symposium on Computer Architecture，简称：ISCA，计算机体系架构

International Symposium on High-Performance Computer Architecture，简称：HPCA，高性能计算机架构

International Conference on Architectural Support for Programming Languages and OperatingSystems，简称：ASPLOS，编程语言和操作系统的体系结构支持国际会议

Design Automation Conference，简称：DAC，设计自动化会议

IEEE International Symposium on Power Semiconductor Devices and ICs，简称：ISPSD，功率器件、电路研讨会

IEEE Radio Frequency Integrated Circuits Symposium，简称：RFIC，射频集成电路研讨会

IEEE Custom Integrated Circuits Conference，简称：CICC，集成电路会议

IEEE International Conference on Computer-aided Design ，简称：ICCAD，计算机辅助设计国际会议

ACM/IEEE International Symposium on Low Power Electronics and Design，简称：ISLPED，低功耗电子设计研讨会

Design, Automation and Test in Europe Conference and Exhibition，简称：DATE，欧洲设计、自动化、测试会议

IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology
Symposium (BCICTS)

IEEE Integrated Circuits, Technologies and Applications (ICTA)

IEEE International Conference on ASIC (ASICON)

IEEE Midwest Symp. Circuits and Systems (MWSCAS)

IEEE International Conf. on Electron Devices and Solid-State Circuits (EDSSC)

Proc. Int. Conf. on Solid-State and Integrated Circuit Technology (ICSICT)

Proc. IEEE International Wireless Symposium (IWS)

Proc. IEEE Int. Symp. Radio-Frequency Integration Technology (RFIT)

2.期刊

IEEE Journal of Solid-State Circuits ，简称：JSSC （顶刊）

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems，简称：TCAD

IEEE Transactions on Circuits and Systems I，简称：TCAS-I （一区）

IEEE Transactions on Circuits and Systems II，简称：TCAS-II （一区）

IEEE Transactions on Very Large Scale Integration ，简称：TVLSI

ELECTRONICS LETTERS，简称：EL

IEEE Solid-State Circuits Letters (SSC-L)

IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS)
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (JxCDC)
IEEE Solid-State Circuits Magazine (SSC-M)
IEEE Radio Frequency Integrated Circuits Virtual Journal (RFIC-VJ)
IEEE Transactions on Semiconductor Manufacturing
Journal of Semiconductor Technology and Science (JSTS)

3.汇总：

电路设计的话，会议： ISSCC > VLSIC > ESSCIRC/CICC/RFIC > ASSCC > ISCAS > 各种local CAS (APCCAS, MWSCAS等)

期刊：JSSC > SSC-L ~ TCAS-I ~ TPE ~ TBIOCAS > TCAS-II >TVLSI > EL …

4.EDA方向：

DAC（国际设计自动化会议，Design Automation Conference）、
ICCAD（国际计算机辅助设计会议，International Conference on Computer Aided Design）、
DATE（欧洲设计自动化与测试学术会议，Design, Automation and Test in Europe）
ASP-DAC（亚太地区设计自动化会议，Asia and South Pacific Design Automation Conference）
一起被公认为电子设计自动化领域水平最高的四大国际会议。
DAC和ICCAD会议固定在美国举办，DATE欧洲举办，ASP-DAC在亚太举办

本文是对如下链接的扩展补充原意是自用总结【专业扫盲】集成电路领域的核心会议与期刊_senator参议员的博客-CSDN博客_集成电路期刊排名