AE/Sales Vacancies –  (Shanghai & Shenzhen& Beijing)

1. Principal Application Engineer-Physical Design (SH/BJ/SZ)

Position Description:

 To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.

 To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips.

 Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area.

 Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs.

 To play a leading role among other team members, while receive little instruction on routine and general assignments.

Position Requirements:

 A bachelor's degree is essential and 7+ years’ experience in IC design, electronic engineering or computer science applications.

 Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.

 Requires working knowledge of one or more programming languages, and effective communication and soft skills.

 An MS degree and/or working experience in multi-nation IC design house is a plus.

2. Principal Application Engineer - Tensilica IP (SH)

Position Description:

 As the member of the APAC Tensilica IP Field Applications Engineering (FAE) Team, you will participate in driving technical and business campaign success with industry leading semiconductor and system companies.

 Understand Cadence’s end customer’s IP needs and provide front line technical support in Pre-Sales and Post-Sales process.

 Champion the customer needs and work with Sales Team, R&D and Product Marketing to develop competitive and creative technical solutions to win campaigns

 Be a key contributor driving product roadmap direction for our next generation products

Position Requirements:

 BS degree in Electrical Engineering/Computer Science or related field

 At least 5+ years of SoC and/or embedded software or DSP algorithm design experience

 Have strong customer facing skills to be able to establish technical & management credibility with the key technical decision makers

 Have experience and/or knowledge of one or more of Digital Audio, DSP, imaging or computer vision technologies

 Previous experience with DSP processor core (Tensilica Xtensa is preferred) or derivatives is highly desirable

 Experience with DSP & CPU architectures desirable – including architectural, software or HW/Debug related

 Experience of embedded software process for DSP development is beneficial, particularly for embedded DSP core architectures

3. Principal Application Engineer- Analog Layout (SH)

Position Description:

 Provide technical support for Cadence Custom IC front to back design flow. Mainly focus on analog circuit layout design and physical verification

 Has thorough understanding of Cadence Virtuoso solution marketplace and objectives, including key players, products and trends.

 Work with customers and sales to define, implement and support advanced custom layout design in technical engagements.

 Support sale to address customers' technical demand to propose and deliver value position for maximizing business opportunities.

 Conduct Cadence Virtuoso products demonstration, presentation, workshop and benchmark to address the customer's technical concerns.

 Provide post-sales support such as products training, software environment maintain, products usage guide to assure customer satisfaction and nurture future sales potentials.

 Ability to openly exchange and communicate technical information with peers, group management, and customers.

Position Requirements:

 Education: BSEE required, MSEE preferred.

 Has over 7 year’s design experience in Analog IC layout design and physical verification, prefer to be familiar with Virtuoso layout suite, PVS, QRC and Skill programming.

 Be proficient in the customer support process.

 Strong verbal and written skills in English are required.

 Have good communication skill and teamwork spirit.

4. Principal Application Engineer- Analog Design (SH)

Position Description:

 Provide technical support for Cadence Custom IC front to back design flow. Mainly focus on analog/RF/mixed-signal circuit simulation products support.

 Has thorough understanding of Cadence Virtuoso solution marketplace and objectives, including key players, products and trends.

 Support sale to address customers' technical demand to propose and deliver value position for maximizing business opportunities.

 Conduct Cadence Virtuoso products demonstration, presentation, workshop and benchmark to address the customer's technical concerns.

 Provide post-sales support such as products training, software environment maintain, products usage guide to assure customer satisfaction and nurture future sales potentials.

 Ability to openly exchange and communicate technical information with peers, group management, and customers.

Position Requirements:

 Bachelor's degree majoring in electronic engineering or computer science applications, with 5+ years’ experience in Analog and RF IC design.

 Mater degree and/or working experience in multi-nation IC design house is preferred.

 Strong verbal and written skills in English are required.

 Have good communication skill and teamwork spirit.

5. Principal Application Engineer- Frontend Verification (SH)

Position Description:

 Work closely with the Sales team to identify and scope opportunities for Cadence Emulation and Acceleration products.

 Plan, execute and manage key technical evaluations and benchmark with existing and potential customers.

 Train, ramp-up and accompany customer project.

 Conduct basic and advanced trainings, presentations and demos as necessary.

 Providing technical expertise to address clients’ queries, which need expert involvement.

 Aligned closely with corporate engineering and sales/marketing team on customer requirement for product direction/improvement.

Position Requirements:

 4~6 years’ experience in the following areas:

 HW verification with knowledge of System Verilog/VHDL and HDL simulators

 FPGA prototyping project experience is a must

 Experience with hardware emulator or accelerator is a big advantage

 Advanced Verification Methodology like UVM is a plus

 Knowledge of Unix and Linux is highly desired

 Strong verbal and written communication skills in English

 Strong teamwork skills with good human relationship

6. Principal/Lead Application Engineer-Digital Backend Design Service (SH)

Position Description:

 To provide backend service in digital IC design implementation from RTL-to-GDSII.

 To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips.

 Have real design experience including conformal check, logic synthesis, DFT, P&R, CTS, STA, MMMC to close timing, power and chip area.

Position Requirements:

 Bachelor degree with experience in IC design, electronic engineering or computer science major.

 Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.

 Requires working knowledge of one or more programming languages, and effective communication and soft skills.

 An MS degree and/or working experience in multi-nation IC design house is a plus.

7. Sr. Field Service Engineer (半导体设备工程师)

Position Description:

 Installs, troubleshoots, and maintains Cadence electronic equipment.

 Serves as the hardware technical representative providing pro-active on site support at end user customer locations throughout Japan and, when required, at overseas locations also.

 Identifies, analyzes and repairs hardware, firmware, network and other issues.

 Schedules part replacements and maintenance with customers as needed.

 Relies on experience and judgment to accomplish goals and ensure customer satisfaction.

Position Requirements:

 Primary contact for all hardware related issues

 Planning and Installation of new equipment at customer sites.

 Troubleshoot/diagnose and repair hardware and other problems, escalate issues when appropriate

 Document all work processes as required

 Establish a strong supportive relationship with customers

 Inventory control

 Work with Field Service team and other Cadence groups to improve processes and procedures.

 Excellent written and verbal communication; speaking and writing skills; ability to communicate complex technical issues in an easy to understand manner; willingness to travel frequently both domestically and internationally. Current passport required.

 Full training will be provided, however any experience in the following areas would be advantageous:

o Debugging and repair experience in a board/system level environment.

o Field service experience in component/board/system level environment.

o Proficiency with SUN & LINUX OS and local area network issues

Sales

Shanghai

1. Senior Account Manager Technology I

Position Description:

This is a technology focused role leading system design and verification Sales expertise

to support the proliferation of our solutions throughout China customers with a focus of

key customers in the territory.

Working in conjunction with the core Technical Field Organization and Sales

Executives, to provide the necessary technology focused strategies to increase business

value.

Responsibilities:

 Work with Account Executive/Account Managers to build healthy pipeline, define verification solution selling Strategy and create technical compelling events.

 Fortressing & growing market share in existing accounts, as well as winning new logos and gain market segment share in new accounts.

 Responsible for technology/product adoption and proliferation within customers (initial qualification, customer knowledge and problems areas, set up evaluation plan with Application Engineers, own the full evaluation process to completion, prioritize Application Engineer activity to focus on winning targets, proliferate technology at all customer’s sites, leads integration of technologies into customers’ projects,…)

 Work with the Technical Field Organization to ensure customer is smoothly transitioned from Pre to Post support

 Work in close partnership with the Account Manager/Account Executive to leverage field progress for technology adoption and incorporate into the business proposals for the account

 Participate in customer visits based on business needs and support of field sales

 Study customer verification related R&D infrastructure and provide analysis of verification based technical decision map

 Play a project management role in major verification campaign in Key customers

Position Requirements:

 BS degree in electronics or related major

 Experience of EDA sales or customer support will be preferred.

 Deep understanding of the semiconductor design chain and ecosystem

 Self-motivated, good in communication and presentation

 Good English in both written and oral

Shenzhen

1. Account Executive

Position Description:

 Building a healthy pipeline of new business opportunities

 Qualifying and closing business to meet with sales target

 Fortressing & growing market share in existing accounts

 Winning new logos and gain market segment share in new accounts

 Developing relationships with key stakeholders at all levels within clients

 Examining Market and proactively generating new opportunities

Position Requirements:

 Bachelor or above degree in electronics related major

 At least 4 years related sales experience, especially software sales or project-driven sales preferred;

 Enterprise and geography sales experience

 Consistent over-achiever

 Deep understanding of the semiconductor design chain and ecosystem

 Self-motivated, good in communication and presentation.

2. Sr. Regional Sales Manager

Position Description:

 Responsible for sales in South China region.

 Play a strategic role in new business development, customer winning back and key client management.

 Work closely with country manage on critical business strategy planning.

 Lead and motivate team to achieve sales quota and drive for revenue growth.

 Provide daily coaching and training to the sales team.

Position Requirements:

 Bachelor degree or above in EE or computer science

 Over 10 year’s sales experience

 EDA industry experience

 Good English ability in both written and spoken

 Leadership skills and experienced in managing sales team with at least 3 years sales management experience

Beijing

1. IP Sales Executive

Position Description:

 Senior level sales position focused on selling value based IP solutions to customers assigned by management and/or located in specific regions around the globe.

 This position will carry an annual sales quota and require work with a cross functional teams.

 Ideal candidate will have experience selling intellectual property and have a complete understanding of SoC front end and back end design, tape-out procedures, semiconductor fabrication processes by technology node and various packaging technologies.

 Person must be willing to travel and potentially cover a large geography.

Position Requirements:

 BSEE, MBA preferred, with 5+ years of successful C-level selling experience.

 This position requires a seasoned sales executive with the ability to interface with key customer executives selling value based Intellectual property solutions.

 Must be experienced in the complete sales process, understand the Semiconductor ECO System and have the ability to interact with Engineering, Procurement and Financial staffs at all levels of a company.

 The ideal candidate will be extremely competitive, have strong communication skills, grasp complex technical requirements and develop and present various complex business model solutions.

 Must have the ability to communicate to a broad range of technical and non-technical people.

 Must be a leader and have a proven track record of developing deep executive customer relationships and marshalling internal resources in order to execute and win complex multi-million dollar IP transactions in an extremely competitive environment.

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