SECS/GEM：PLC与MES间解决方案

SECS/GEM是由国际半导体设备连接性标准。此连接性标准用于在设备和工厂的资讯和控制系统间建立通讯。被定义为制造设备实现通讯和控制的一般模型。一般来说，SECS/GEM标准定义了信息、状态机和情境，来让工厂软件能够控制并监视制造设备。
　　在实现SECS/GEM标准的工厂内，存在主机和设备这两方。由制造商（工厂）运行与设备接口建立通讯的主机软件。主机无需遵守完整的连接性标准，因为它只设定设备的预期行为。不过，若要使用接口，主机必须进行主机端通讯。SECS/GEM为每条可能的主机信息设定了清晰的设备预期行为。
虽然SECS/GEM已经挺有历史，但是在国内没有优秀的产品，金南瓜解决方案让你的设备稳定及流畅。
这方面的资料太少了，而且领域性太强。这里面涉及到的半导体设备相关、网络相关、软件相关、工厂业务的内容等等，太多了，如果你是从事纯软件开发的人想要涉足这块内容还是需要化费一定精力的。
里面涉及设备的运行以及工艺问题，如果刚刚入门的人来说，太过于艰难了。
SECS/GEM介绍
SECS/GEM定义半导体生产设备与主机之间的通讯关系，通讯标准。SECS/GEM通讯规则如下图，FAB负责MES进行控制整个车间的生产。

设备不需要关心SECS/GEM的实现，里面集成Event和支持动态配置报表Report，数据上报等大量内容。
我们是毫秒级响应，不像一些SECS/GEM Driver。支持不全并且低效的处理方法。
你们需要添加新资料时候，随时可以自行添加。添加方法我们会指导得清清楚楚。配置内容保存在本地，无需担心开机与关机导致数据丢失问题。
时刻遵循着最新的协议，让你的走在行业领先。功能全方位考虑清楚，久经考验。

In many equipment control applications there is a need for a GEM host to modify one or a small set of
process parameters associated with a recipe. The number of parameters modified, frequency of modification (e.g.,
wafer-to-wafer, batch-to-batch, etc.), range of modification, etc., is largely a function of the equipment control
application. Utilizing GEM, at least two methods are envisioned for modifying process parameters on a tool. With the
first method, ‘Equipment Constants’ can be used to relate process parameters of the updated recipe. Equipment
Constants can also be used in a mode where they relate suggested modifications to process parameters from the stored
recipe; that is, the constants contain only the ± differential from a nominal value. The former mode is preferred because
it better ensures data integrity between the controller and tool. With the second method the entire recipe could be
downloaded, but this results in an enormous amount of communication overhead. Note that, in all cases, the Equipment
Constants do not replace the process parameters inside a recipe, but are associated with (e.g., linked to) these
parameters to relate modifications. The remainder of this application note provides a description of how process
parameter modification can be implemented using existing GEM capabilities. The method may be used in a GEM
compliant system provided that the specific GEM capabilities described are supported.

The equipment constants should represent the actual values of the process parameters with which they are
associated. Depending on the equipment operation and control application, the equipment constant could represent
the actual value of a process parameter at a recipe step, or over the entire recipe. The equipment constants could also
be utilized to represent the differentials of process parameters from nominal values. However it is important to note
that, when using differential values to relate process parameter modifications, any loss of synchronization between
equipment and host could result in an incorrect assessment of the value of a process setpoint by the host. Note also
that, upon system startup, and whenever the appropriate process parameters are modified, the equipment constants
should also be modified as necessary to always reflect the (absolute or relative) values of the associated process
parameters.
NOTICE: This Related Information is not an official part of SEMI E19.3 and was derived from the work of the
Physical Interfaces & Carriers Global Technical Committee. This Related Information was approved for publication
by full letter ballot procedures on August 22, 2013.
NOTE 1: The material contained in this Related Information is not intended to modify or supersede the Standard SEMI E19.3 in
any way. These notes are provided as a source of information to aid in the application of the Standard, and are to be considered
reference material. Determination of the suitability of the material is solely the responsibility of the user.
R1-1.1 A Related Information to SEMI E19 provides the position of existing reticle SMIF pod (RSP150) sensors and
implementation advice. The users of this Standard are recommended to consult this Related Information for reticle
SMIF pod detection.
NOTICE: SEMI makes no warranties or representations as to the suitability of the Standards and Safety Guidelines
set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline
is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards
and Safety Guidelines are subject to change without notice.
By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights
or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of this
Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights, and the
risk of infringement of such rights are entirely their own responsibility.
5.3.1 The actual shape of these curves and time intervals is dependent on the design of the MFC under test, the
elastomer used, if any, and the characteristics of the leak detection system. These time intervals must be determined
using sound engineering judgment following qualification testing of the specific MFC model and test set-up. Once
determined, it is recommended that receiving inspection consist of measuring for leak rate value w1 at the end of
interval t2.
5.3.2 Following qualification testing, report typical values for t1 through t4 and w1 and w2. w1 is primarily the
mechanical portion of the leak, and w2 is mechanical plus permeation. In the case where w2 is significantly greater
than w1, w2 is primarily permeation. In the case of a gross mechanical leak, w1 could greatly exceed, and thereby
mask, w2.
NOTE 4: To prevent false leak rate readings that could arise from helium permeation, this test should be performed with elastomers
that were not previously exposed to helium. If exposed to helium, the MFC must be purged of helium by the passage of time and/or
baking.
5.3.3 In good leak testing practice, the background level should be verified before the application of helium to ensure
that the elastomers are in a helium degassed state and that the leak detecting system is in proper operation.
5.2.3 Control Valve Seat Leak Test — The purpose of this test is to determine the leakage through the control valve
under simulated operation in the closed control mode. The MFC should be electrically energized for normal operation
and placed in the closed position as specified for the operation of the MFC. The input pressure to the MFC should be
100 kPa ± 20%. The outlet should be connected directly to the helium leak detector, and pressure should be as low as
possible using good leak detector practice (see Figure 3).
5.1 General Requirements
5.1.1 Leak Detector — The leak detector shall be of the helium mass spectrometer type. It shall have sensitivity at
least equal to or smaller than the specified leak rating of the MFC to be tested. If the actual leak rate is to be reported,
the sensitivity shall be five times smaller than the leak to be measured. If the sensitivity is not five times smaller, the
actual leak rate may be reported if the sensitivity of the detector is also reported.
5.1.2 Helium must have access to all primary seals.
5.1.3 Connections between the MFC and the leak detector must be leak-tight.
5.1.4 The ambient temperature of the MFC should be 25°C ± 5°C unless otherwise specified. If another test
temperature is used, it must be recorded during the test.
5.2 Test Procedures — There are two basic setups which may be used to measure the leak rate from the external
environment to the internal gas passages of the MFC or from the internal passages to the external environment. Results
for either test method may be reported. The method used must be reported as well. A third test, the through-the-valve
setup, is intended to measure the quality of the valve seat shutoff.
5.2.1 Internally-Pressurized Leak Test — The purpose of this test set-up is to simulate operation of the MFC under
conditions where the internal pressure is above ambient. The recommended internal pressure is 300 kPa absolute
(30 psig) of helium (see Figure 1).

SECS/GEM：PLC与MES间解决方案相关推荐

多台PLC连接MES系统解决方案
多台PLC连接MES系统解决方案在智能工厂数字化转型中,经常出现一条生产线使用了不同品牌不同型号的PLC的状况,要把这些PLC连接到MES系统,需要系统工程师花费大量的时间与精力. 通过钡铼技术的P ...
plc secs通讯协议_SECS/GEM解决方案：PLC与MES间的通讯
符合SEMI E4, E5, E30, E37 的 SECS/GEM通讯方案遵循 SEMI 人机交互设计,提供触摸屏支持让你触手可及. 毫米级的响应,让设备行云流水般流畅. 我们为你快速搭建PLC与 ...
SECS/GEM：PLC与MES间处理
SECS/GEM是由国际半导体设备连接性标准.此连接性标准用于在设备和工厂的资讯和控制系统间建立通讯.被定义为制造设备实现通讯和控制的一般模型.一般来说,SECS/GEM标准定义了信息.状态机和情境, ...
HSMS/SECS/GEM/GEM300半导体通讯协议介绍
HSMS/SECS/GEM/GEM300半导体通讯协议解决方案介绍目录 SECS/GEM协议通讯 1 目录 2 1.介绍 3 1.1 产品概述 3 1.1.1 高扩展性 4 1.2 通讯实现 4 1 ...
PLC SECS/GEM解决方案，设计与应用
1 适用性金南瓜SECS是最适应于全自动智能设备的选择. 适用行业:半导体.光伏.PCB等全面支持E5.E30.E37.E40.E87.E90.E94.E116 PLC SECS/GEM具有怪兽级 ...
PLC SECS/GEM半导体通讯解决方案
PLC To SECS/GEM方案适用于PLC控制器的统一SECS / GEM接口 JNG PLC SECS/GEM控制器提供高稳定性的桥接环境. 可以运行多个不同的自动化服务,也可以作为用户显示终 ...
SECS/GEM使用
1. 介绍金南瓜SECS是最适应于全自动智能设备的选择. DMS SECS具有怪兽级的强劲性能,全面升级的高适应性,易用友好的SECS工具,利于快速开发部署. 金南瓜SECS兼容运行在独自工控机,或 ...
半导体设备通讯标准(SECS/GEM)
目录收起前言一.SECS/GEM 简介二.系统的硬件组成三.搞清楚需求.(搞明白是什么,基本玩法规则) 1.secs是一个协议族 2.secs的消息通信 3.甲方的secs的标准不一定是 ...
EAP通讯基础之SECS/GEM/GEM300mm
EAP系统用于控制半导体设备进行自动化生产.与MES系统整合,校验产品信息,自动做账,同时收集产品生产过程中的制程数据和设备参数数据,帮助提高半导体工厂的生产效率,避免人工操作失误,提高产品良率. 而 ...

SECS/GEM：PLC与MES间解决方案

SECS/GEM：PLC与MES间解决方案相关推荐

最新文章

热门文章