QCOM和其他常见芯片平台术语缩写

1 QCOM
1.1 General
Qualcomm: Quality Communications
ALSA DCP：ALSA由DAI、Codec、Platform三部分组成
ALSA TLV：Type-Length-Value
Alternative Mode: 替代模式
ANC：Automatic Noise Canceller
ASM: Anntena Switch Module
AT：ATtention Command
ATCoP：AT Command Processor
BHI: QFIL Boot human interface for PCIe
bootloader DA：Download Agent，MSM的firehose就是DA，而PBL也叫做bootROM
CAT M1: Category Minus 1
CCC：Common Command Codes，for I3C（Android 9.0 ADSP支持，类似于USB HSIC）
CCGP：Windows USB Common Class Generic Parent，Linux内核类似的驱动就是usb_generic_driver
CDT：Configuration Data Table
CNN：Android中的ConnectivityService、NetworkPolicyManagerService、NetworkStatsService（数据统计）、NetworkManagementService（最底层，物理网络接口的管理服务，与netd通信）
config_tether_upstream_types：Android手机配置为ApCli（AP-Client）时，作为Client的一方
config_tether_usb_regexs：regular expressions，正则表达式
CSP: Continue on Short Packet , DWC3
CV: Customer Visit
DMIPS：Dhrystone Million Instructions executed Per Second，每秒执行百万条指令
DRI: Directly Responsible Individual，SSC Data Ready Interrupt
DS：USB Data Service
DSDA：Dual SIM Dual Active
DSDS：Dual SIM Dual Standby
DSR: Deferred Service Routine
EDL: Emergency Download
FFBM: Fast Factory Boot Mode
FLCB: Fast Low Current Boot
FLP：Fused Location Provider
FSG: A Golden File System
GDHS: Globally Distributed Head Switch (L2 cache)
GENI: QUPv3 Generic Interface
GLink：General Link，代替SMD的新机制
Gobi：Global Mobile Internet Technology，全球移动互联网技术，如MDM9x15等系列
HDET: High Power Detector
HIDL：HAL Interface Definition Language，读作hide-l；/dev/vndbinder - vendor binder
HKADC: Housekeeping ADC, 交互管理ADC
HMD：The Home Of Nokia Phones
HMSS: Hydra-Monaco SubSystem, qcom application processor
HVDCP3: DPF_DMF values for Floating（non-drive mode）and DPR_DMR values for Removing the float of DP/DM lines.
HVDCP-OPTI：High Voltage Dedicated Charging Port-OPTImization（QC3.0 and QC4.0 PPS）
IAAD: EHCI Interrupt on Async Advance Doorbell
IOA: Interrupt on ACK, USB
IOC: Interrupt on Completion（DWC3）；Interrupt On Change（for PIC MCU）
IOT: Interrupt on Token, USB
ISP: Image Signal Processor
ISP: Interrupt-on Short Packet, DWC3
KBA: Knowledge Base Article
LDPC：Low Density Parity Check，for 5G
MBHC：MultiButton Headset Control
mbn: Modem Configuration binary
MDM: Mobile Data Modem
MLME：Mac Layer Management Entity
modemst: modem efs partition
MSM: Mobile Station Modem
MTC: Machine Type Communications
NV：Nonvolatile Data
OCMC: On-Chip Memory Controller
PBL：Primary BootLoader
PBM: Phonebook Manager
PC: Parallel Charger (并联充电模组)
PDC: Power Domain Controller
PDU：Protocol Data Unit
PMxxxx: xxxx PMIC Core
PMIxxxx: xxxx PMIC Interface
PMIC BCD：Bipolar CMOS DMOS
PPID：Parent Process ID（Linux ps命令可以看到）；MFi Product Plan ID，例如 = 147312-0020，106455-0155
QAM8295P: Qualcomm Automotive infotainment Module
QCA: Qualcomm Atheros
QCCI：QMI Common Client Interface
QCMAP: Qualcomm Mobile Access Point Service
QCPE: QualComm TZ Protected Element
QCSI：QMI Common Service Interface
QDSP：Qualcomm Digital Signal Processor
QFE: Qualcomm Front-end
QHEE：QCOM Hypervisor Execution Environment
QMI：Qualcomm MSM Interface
QMI_PDS：QMI Position Determination Service - for GPS
QPNP: Qualcomm Plug and Play
QSC: Qualcomm Single Chip
QSD: Qualcomm Snapdragon
QTI SLPI GPIO: sensor low power interface, SSC GPIO
RBCO：Rock Bottom Current Optimization，底电流调试
RDM：Runtime Device Mapper
REX：Real-time Executive OS
RMA: Return Material Authorization
RFFE: Radio Frequency Front-end
RTR: Radio Transceiver
S801: MSM8974AA
SAM: Sensors Algorithm Manager
SBL：Secondary BootLoader
SBZ：Should Be Zero
SCHG: Switching charger
SDU：Sensor Data Unit
SEE: Sensors Execution Environment
SIO：Serial Input and Output，对各种串行接口数据的预处理（SDIO/UART/USB）
SLPI: Sensor Low Power Island
SMD：Shared Memory Device
SNOC：System Network On Chip
Socket BLA：bind()、listen()、accept()
SRLTE: Simultaneous Radio and LTE
SSC: Snapdragon Sensors Core, used by aDSP
SSR：SubSystem Restart
SSUSB-QMP：QCOM Multiple Protocol Phy
SURF: Subscriber Unit Reference Platform
TCSR: Top Control and Status Register
TE：Terminal Equipment
ThreadX: X means context switching
Tilt Sensor：抬手亮屏传感器，另外一个Wrist Sensor（检测翻腕动作），与Tilt差不多
TLMM: GPIO Top Level Mode Multiplexer
ttyAMA: ARM AMBA PL011, for QNX Hypervisor
ttyHSL: tty High Speed Serial Lite
ttySAC: tty Special Administrator Control
UniPro: Universal Protocol
USAM: Universal SSC Algorithm Module，ADSP SSC算法模块
WCD: wafer codec/decode
WCN: wireless connectivity network
WTR: Wafer Transceiver
XBL：Extended BootLoader
XPU: Embedded Memory Protected Unit

1.2 SoC
APQ: Application Processor Qualcomm
MPQ: Media Processor Qualcomm
SDA：Snapdragon Auto（汽车APQ）
SDAm：汽车MSM
Snapdragon Mobile (SDM) = MSM
Snapdragon Modem（SDX）= MDM
Snapdragon Mobile (Compute) (SDA) = APQ
Snapdragon Mobile (Compute) (SDC) = MSM
SDW：Snapdragon Wear
SDW1100 = MDM9207-1
SDW1200 = 取MDM9206的Modem和Snapdragon Wear 1100/2100的AP
SDW2100 = MSM8909w

1.3 DSP
NPU: qcom Neural Process Unit, DSP and CM3
aDSP: qcom audio DSP
cDSP: qcom compute DSP
mDSP: qcom modem DSP
sDSP: qcom sensor DSP, SLPI

1.4 Platforms
ADP：Automotive Development Platform
CDP：Core Development Platform
FFA: Form Factor Accurate
FLUID：Forward Looking User Interface Device
LiQUID：Large Qualcomm User Interface Device
MTP：Modem Test Platform
QRD SKU：Qualcomm Reference Design Skull
SURF: Subscriber Unit Reference Platform

1.5 MSM软件成熟度
FC：Feature Completed
ES：Engineering Sample
CS：Commercial Sample

1.6 QMI
DMS: Device Management Service
NAS: Network Access Service
UIM: User Identity Module
WDS: Wireless Data Service

2 Charge
2.1 Misc
OPPO VOOC：Voltage Open-Looped, Multi-Step Constant-Current Charging，电压开环，多步恒流充电

2.2 MTK Charge
BATSNS：充电电流检测电阻的负极
BAT：电池正极引脚
BAT_ON：电池NTC (热敏电阻) 引脚
CAR：库仑计
Cmax/Qmax：电池容量
DOD：Depth of Discharging，放电深度百分比
ept：MTK Easy PinMux Tool
IPO: MTK Instant Power On
ISENSE：充电电流检测电阻的正极
mAh：放电容量
OCV：Open Circuit Voltage，开路电压
RECHARGING_VOLTAGE: 回充电压
R (battery)：电池内阻，(V2-V1)/400mA
SOP: Standard Operation Procedure，操作指导
VC (=VBAT)：Voltage of Closed Circuit，闭路电压，Charge ADC采样的到电压就是闭路电压
VCHG：USB正极
VCDT：VCHG Charger Detect充电电压检测脚
ZCV：（Zero Current） Voltage，零电流-电压，一般指ZCV的2个表格（开路电压-放电深度百分比，开路电压-电池内阻）

3 Display and Camera
3.1 General
3A：自动对焦（AF）、自动曝光（AE）、自动白平衡（AWB）
CSI：Camera Serial Interface
DSI：Display Serial Interface
EOS：Electro Optical System，佳能电子光学系统
EVS：Exterior View System，Android车载系统Camera架构HAL层（不同于手机Camera架构）
FPC指纹：FingerPrint Cards AB
FPD：Flat Plane Display
GMSL：Gigabit Multimedia Serial Link
HPD：HotPlug Detection
NTxxxx屏幕：联咏科技novatek
TNT显示器：Touch & Talk

3.2 ADAS摄像头种类
ADAS：Advanced Driver Assistance System，先进驾驶辅助系统，Bosch提供整个方案模块
ADASIS：Advanced Driver Assistant Systems Interface Specifications，EHP规范
AVM：Around View Monior，360°环视摄像头
DMS：Driver Monitoring System，疲劳驾驶监控，使用GHS INTEGRITY RTOS系统，通过车载以太网通信（PHY工作在Master模式，连接时，会主动和Slave PHY进行链路训练），法国Valeo提供方案
DVR：Digital Video Recorder，行车记录仪
HAP: GWM Highly Automatic Parking
IRK: BMW Innenraumkamera, interior camera
OMS: Occupancy Monitoring System
RVC：Rear View Camera，倒车影像
SVC：Side View Camera，盲区摄像头
UCAP: BMW UltraSonics Camera Automated Parking, including EAVB AVM
VIMS: GWM Video Intelligent Monitor System with EAVB supported

3.3 touch
FTS touch: Focaltech Systems

4 GNSS
C/A码：Coarse / Acquisition Code，粗码
CNR：Carrier Noise Ratio
EPO: Extended Prediction Orbit
GGA: Global Positioning System Fix Data，定位信息
GLL: Geographic Position, Latitude/Longitude，地位地理信息
GNRMC：Global Navigation Recommended Minimum sentence C，多模推荐定位信息
GPRMC：GPS Recommended Minimum sentence C，GPS推荐定位信息
GSA: GPS DOP and Active Satellites，当前卫星信息
GSV: GPS Satellites in View，可見卫星信息
NAV-DOP：Dilution of Precision，精度因子，U-BLOX的私有的UBX消息包
NAV-PVT：Position Velocity and Time（UTC），U-BLOX的私有的UBX消息包；fixType表示定位有没有成功标志字段，velN表示NED north velocity
P码：Precise Code，精码
QMI_PDS：QMI Position Determination Service - for GPS
RMC: Recommend Minimum Specific GPS/TRANSIT Data，推荐定位信息
RTCM：Radio Technical Commission for Maritime services，海事无线电技术委员会
VTG: Track Made Good and Ground Speed，地面速度信息
ZDA: Time & Date，时间日期信息

5 GPU
Adreno：名字改自于Radeon
Falcon：FAst Logic CONtroller。NVIDIA私有的RISC MCU，主要用在桌面GPU（Falcon中的寄存器一般映射到PCI BAR0）或者Tegra xHCI控制器中。NVIDIA正在把私有的Falcon MCU架构换成RISC-V
GC7000: Vivante GC (Graphics and Compute), used by iMX 6 and iMX 8
GeForce：Geometry Force，几何威力
GTX显卡：Grand Touring eXtreme
IMG AXT-64-2048：Imagination Technologies；A表示AI，A系列的意思；XT表示eXTreme
LE：Low Edition，低端版
Mali：Maliak，在克罗地亚语中的含义是small
RTX显卡：Ray Tracing eXtreme
TI：Titanium 钛
Voodoo：这个起源于南美古老而又神秘的宗教，巫毒教

6 MCU and SOC
6.1 ARC
ARC：Synopsys Argonaut RISC Core
ARC EM5D：Synopsys ARC Embedded 5 DSP
ARC EM SEP：Synopsys ARC Embedded Safety-Enhanced Processor
ARC HS：Synopsys ARC High-Speed

6.2 Automotive
AURIX: Infineon Automotive Realtime Integrated NeXt Generation Architecture
TC265: Infineon TriCore (Triple Core), RISC/MCU/DSP
XMC: Infineon Cross Market Microcontroller, based on ARM Cortex-M
ITMON: Samsung EA9 IPs Traffic Monitor, 36bit physical memory address bus
S2MPU: Samsung EA9 Stage-2 Memory Protection Unit
vGEN: Samsung EA9 Hypervisor VID Generator

6.3 CE
ABOV：AP（Application Processor）Division of Magnachip Semiconductor，韩国现代单片机
AT91SAM9260：SAM means Smart ARM-based Microcontroller
ATMEL SAMBA：ATMEL Smart ARM-based Microcontroller Boot Assistant
CC2540：ChipCon
CHKS009：鑫汇科电磁炉MCU
ED：Engineering Debug
EFM32：Silicon Labs, Energy Friendly Microcontroller
ICC：Integrated Cockpit Controller
IOC：Input Output Controller，车机MCU
LPC：NXP, Low Power Consumption
Marvell SoC ARMADA：（西班牙的）无敌舰队
MCS-51：Micro Computer System
Microchip PIC：Programmable Interface Controller
MSP：TI, Mixed Signal Processor
OTA：Running change
PSoC：发音p sock，Seattle Cypress Microsystems Inc, acquired by Cypress Semiconductor Corporation, http://blog.chinaaet.com/fy_zhu/p/31978
PXA：Xscale Application Processor
RA：Renesas Advanced
RX：Renesas eXtreme
RH850：Renesas High-performance
RISC-V：读作risk-five，表示为第5代RISC
STC：SysTem Chip
Tegra K1：K means Kepler
Tegra X1：X means Maxwell，Drive CX（Cockpit Maxwell），Drive PX（Auto-Pilot Maxwell）
Workaround：确定现象，找不到root cause，但是可以解决；与rework的意思大概相同（可能印度人用的多）

6.4 DSP
CEVA公司：塞瓦定理，是由意大利几何学家Giovanni Ceva发现，用来证明共点线的一个几何原理，通常称为汇集定理。当今将各种技术汇集在单个产品之上正是半导体工业大势所趋，以塞瓦定理命名的CEVA公司也正是秉承这一理念才走到了今天。

7 Misc
CoAP：The Constrained Application Protocol
MFF：eSIM M2M form factors
RCA：Root Cause Analysis
RMA：Return Materials Authorization，芯片失效测试，一般是指公司内部的退货流程，假设一公司售出某物品, 因为品质问题或出错货，客户要求退货，公司经过与客户沟通后，确认客户可以退货
SOP：Standard Operation Procedure，操作指导
SOP：Start Of Production，开始量产

8 NXP/Freescale
74HC04D：High CMOS，最后一个D表示封装形式
HCS08：Freescale High-speed CMOS Speedup，简写为S08
iMX287: integrates the first generation FEC and MorethanIP L2 switch, MorethanIP GmbH was acquired by Synopsys in 2021
ISP1161：Philips' Integrated host Solution Pairs 1161，“Firms introduce USB host controllers”，https://www.eetimes.com/document.asp?doc_id=1290054
MC i.MX6Q：（Motorola Advanced Computer System on Silicon）innovative Multimedia eXtended 6 Quad Core；最早由SigmaTel创立
Motorola：Motor表示汽车，ola表示声音，合起来，就是汽车之声
MQX RTOS：Message Queue eXecutive
NE555: 555 Timer IC. Made by Signetics which is Signal Network Electronics, hence NE is Network Electronics
NPU: iMX 8M Plus integrates Vivante VIP8000 NPU
PowerPC：Performance Optimization With Enhanced RISC – Performance Computing；the "PPC" prefix is IBM terminology；Motorola uses the mnemonic "MPC" instead
S32: NXP scalable
SBC：Single Board Computer
SJA1000：Stand-alone CAN controller，C51并行接口
TFA：Terminal For Amplifier
TJA1050：Transceiver，High-speed CAN transceiver
UJA1164：Mini high-speed CAN System Basis Chip（SBC）transceiver， SPI接口

How to find NXP PNI?
search "NXP Product Numbering Information"

9 Sensor
9.1 General
HRV：Heart Rate Variability（心率变异性），光电心率没有办法检测HRV数据的，需要ECG才可以测量；心率变异性(HRV)特指心跳时间间隔的微小变化。心率变异性变化越大，表明自主神经系统对身体协调作用越好、身体具备更多的活力。测量心率变异性(HRV)可以直观反映一个人的身体健康状况，并且也能够判断目前的训练方式对改善身体状态是否有效。
PDR：Pedestrian Dead Reckoning，室内定位(计算相对位置的定位方法)，PDR定位是一种基于传感器信息计算相对位置的定位方法，首先通过加速度传感器检测行人的步数并计算出步长，然后通过磁阻传感器和陀螺仪计算出行人的航向角，最后获取人体移动的相对位置从而实现定位。相较于其他室内定位方法，PDR不受外界环境影响，定位精度较高，但只能获取相对位置信息且存在累积误差。
PPG：photoplethysmography，光电心率传感器，Apple Watch用的就是这种。

9.2 Bosch
BHI160B：Bosch Sensor Hub with MEMS IMU 160B
BMA355：Bosch 3-Axis MEMS Accelerometer 355
BMI160：Bosch 6-Axis MEMS IMU 160

9.3 ST
AIS328DQ：Automotive Inertial Sensor - 3 axes - 2/4/8g full scale - Digital Output - QFPN package
A3G4250D：Automotive - 3 axes - Gyroscope - 4x4 LGA 16L - 245dps full scale - Digital Output
LIS3DH：Linear Inertial Sensor - Digital Output - High Level
LPS001DL：Linear Pressure Sensor - Digital Output - Low Level
LSM303DLH：Linear Sensor Module - Digital Output - High Level

10 TI
AM335x：ARM MPU，可以运行Linux的才叫MPU，否则叫MCU，用于工控
BB: Burr Brown, co-founded by Robert Page Burr and Thomas R.Brown Jr., PCM1972. Acquired by TI
BQ：Benchmarq
CC2530：TI ChipCon2530
DRA746：DRAgon，Jacinto，名字来源于德州仪器汽车电子处理器美国办公室旁边的一条河
LM117 / LM317: W117 / W317, Fundamentals of Analog Electronic. The LM in the part number stands for Linear Monolithic (线性单片电路), which National Semiconductor used to describe many of their analog ICs
LM555: 555 Timer IC. The LM in the part number stands for Linear Monolithic, which National Semiconductor used to describe many of their analog ICs
McBSP：Multichannel Buffered Serial Port
TDA：TI Driver Assistance
TIP110: Texas Instruments Power
TLC：Texas Instruments Linear CMOS
TLV：TI Low Value，高性价比
TMS：Texas Manufactured Semiconductors
TMX：Texas Manufactured Experimental Device
TPS：TI Performance Solution

11 USB
ACP：iPod Authentication CoProcessor，IC mfi337s3959
iAP2：iPhone CarPlay iOS Accessory Protocol, Version 2，iAP2分为3层，分别是传输层、链路层、会话层；而iAP1没有分层的概念
ARC：Argonant RISC Core
ATS：Accessory Test System，iPhone Carplay自测试
CCG2：Type-C Controller Generation 2
CCG3PA：Type-C Controller Generation 3 Power Application
CCGP：Windows USB Common Class Generic Parent，Linux内核类似的驱动就是usb_generic_driver
CMG1：USB Type-C EMCA Controller Generation 1
DP：Dual Port，或者Display Port
DWC2/DWC3：Design Ware Controller，Apple的嵌入式设备，包括iPad和iPhone都是使用的DWC2
EZ-USB：Easy AnchorChips
FTDI：Future Technology Devices International
giveback：归还 - ehci_urb_done() -> usb_hcd_giveback_urb()。USB PD中的giveback（= 1）指sink会响应source的GotoMin请求，返还部分电力给source。
GRL：Granite River Labs ，美国工程测试认证实验室
HX3C：Cypress USB Type-C Hub with PD
IAAD：EHCI Interrupt on Async Advance Doorbell
iPhone XR：R means Regular
ISP1161：Philips' Integrated host Solution Pairs 1161，“Firms introduce USB host controllers”，https://www.eetimes.com/document.asp?doc_id=1290054
MDATA：More DATA，USB双缓冲（ep_kind配置使能）切换机制对应到DATA0和DATA1
MTK BICR：Built-in CDROM
NEC uPA, uPB, uPC, uPD：uP：微型产品（micro Product），A代表Analog（混合元件），B代表bipolar（双极数字电路），C代表双极模拟电路，D代表单极型数字电路
PDI1394L40BE，PDIUSBD12：TODO
PTN5100：Part Number
Quirks：the attributes of a device that are considered to be noncompliant with expected operation
RNDIS OID：Object Identifier
RNDIS wceis：Windows CE Internet Sharging，（WceIsVista.INF -- This is the inf installation script for RNDIS-over-USB host driver for Intenet Sharing device.）
Renesas名字由来：Renaissance Semiconductor for Advanced Solutions
SL811HS：Cypress/ScanLogic 811 Host/Slave，性能上与ISP1161（Integrated host Solution Pairs 1161）相当
SPH：USB Single-Port Host
SSUSB-QMP：QCOM Multiple Protocol Phy
TDI：TransDimension Inc.，该公司首先发明了将TT集成到EHCI RootHub中的方法，这样对于嵌入式系统来说，就省去了OHCI/UHCI的硬件，同时降低了成本，作为对该公司的纪念，Linux内核定义了宏ehci_is_TDI(ehci)；产品UHC124表示USB Host Controller；收购了ARC USB技术；现已被chipidea收购，chipidea又被mips收购
TT：Transaction Translator（事务转换器，将USB2.0的包转换成USB1.1的包）
µAB：Micro AB
USB BH reset：Bigger Hammer or Brad Hosler，表示warm reset；you may be confused why the USB 3.0 spec calls the same type of reset "warm reset" in some places and "BH reset" in other places. "BH" reset is supposed to stand for "Big Hammer" reset, but it also stands for "Brad Hosler". Brad died shortly after the USB 3.0 bus specification was started, and they decided to name the reset after him. The suggestion was made shortly before the spec was finalized, so the wording is a bit inconsistent.
USB3 BULK Stream ID：对应到SCSI Tag或者SATA Tag
USB KVM：KVM是键盘(Keyboard)、显示器(Video)、鼠标(Mouse)的缩写；KVM端口是25-pin，包含VGA接口和USB接口
uSOF：micro Start of Frame，125us
VIL：wValue，wIndex，wLength
WinPE：Windows Preinstallation Environment

12 x86
ABL：Automotive BootLoader，是UEFI的一部分，ABL负责启动bootloader（= kernelflinger），kernelflinger启动boot.img
Android LTS：Long Term Support
Android MR1：Maintenance Release
ELK：Emergency Linux Kernel
GR_MRB：Gordon Peak Modular Reference Board
HECI：Host Embedded Controller Interface，Host OS和x86 ME的通信接口，只有4pin，分别是REQ#、GNT#、TX和RX，目的是为了代替SMBus
IFWI：Intel Proprietary Integrated Firmware Image
Intel BXT：Broxton
MEI：Intel Management Engine Interface；一个独立的子系统，使用ARC处理器，OS是Minix 3，固件整合到BIOS中，通过PCI桥片在x86端访问ARC的local端
MPH：USB Multi-Port Host，Intel APL (Gen9, A39X0) 8-port MPH xHCI的Port1作为OTG使用，和DWC3（仅作为slave）使用一个MUX开关来控制Host还是UDC连接到该Port1
TOS：Trusted OS，类似于ARM的TZ
vbmeta：Verified Boot Meta Image Partition

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