8255与8295同为高通第四台座舱芯片，大体上各项参数都差不多，某些参数8255更强，而有的参数则是8295更强一些。从价格上看，似乎8255比8295更有优势一些，未来有可能会成为新的主流座舱芯片（毕竟8295还是比较贵）.

update@0704

更新部分性能参数

1，关于8255 GPU 1300 GFLOPS 只比8155 1100 GFLOPS多不到20%的提升，按照高通的说法，虽然数值上增加不多，但是GPU的架构进行了升级，从benchmark测试结果来看，性能比8155提升80%以上

2，AI算力8255存在多个版本，目前确定的是24T不是最终上限

@update@0712

3，关于SA8775P 这个芯片，高通的定位是舱驾融合的SOC，8255和8775这两个SOC的所有参数都是一样的，除了AI算力，8775的AI支持48/72T两种配置，而8255最高支持到48T（需要额外打开另外两个AI核）

4,对于8255 高通的定位是中高端的座舱芯片，而8775是舱驾融合的芯片

5，前期8255和8775的软件是同一个软件基线，会在23年底分成两个不同的软件基线（毕竟是两个产品方向）

6，高通会在下半年到24年主推8255/8775两款芯片

7，考虑到英伟达的索尔芯片要到2025年才会落地，猜测很有可能在2025年之前，高通还会推出性能更强劲的SOC对标索尔芯片.

SoC Chipset Feature Comparison

Feature	SA8155P	SA8255P	SA8295P
Process	7 nm	5 nm	5 nm
Package	23 mm × 23 mm × 2.26 mm FCBGA+HS	25 mm × 25 mm × 2.31 mm FCBGA+HS	25 mm × 25 mm × 2.25 mm FCBGA+HS
BGA pitch	0.7 mm	0.6 mm	0.6 mm
AECQ	Grade 3	Grade 3	Grade 3
CPU	Qualcomm ® Kryo™ 485, 2 MB L3 1 x Gold prime core up to 2.419 GHz 3 x Gold cores up to 2.131 GHz 4 x Silver cores up to 1.785 GHz	Kryo Gen 6, 2 MB L3 per cluster 4 x Gold prime core up to 2.35 GHz 4 x Gold prime core up to 2.35 GHz	Kryo 695, 8 MB L3 4 x Gold prime core up to 2.5 GHz 4 x Gold cores up to 2.05 GHz
DMIPS	105K	189/230K	220K
Memory	4 × 16 LPDDR4X; up to 2092.8 MHz	6 x 16-bit LPDDR5; up to 3200 MHz	8 × 16 LPDDR4X; up to 2092.8 MHz
GPU	Qualcomm ® Adreno™ 640	Adreno 663	Adreno 695
GPU（GFLOPS）	1100	1100/1200/1300	3000
AI/NSP	V66, 4 x Qualcomm ® Hexagon™ Vector eXtensions (Qualcomm ® Hexagon™ Vector eXtensions (HVX)), 1 x HCP, up to 1.459 GHz	V73, four HVX, two HMX, up to 1.5 GHz	V68, 4 x HVX, 2 x HMX, up to 1.4 GHz
AI(TOPS)	8	10/15/24/32/48	40~50
DPU	Adreno DPU 895, 24 MP, DSC v1.1, up to 530 MHz	Adreno DPU 1199, 48 MP, DSC v1.2, up to 600 MHz	Adreno DPU 1199, 64 MP, DSC v1.2, up to 600 MHz
Camera Processor	Qualcomm Spectra™ 380 ISP, 2.5 Gbps/lane, 40 Gbps total	Qualcomm Spectra 690, 2.5 Gbps/lane, 40 Gbps total	Qualcomm Spectra 395, 2.5 Gbps/lane, 40 Gbps total
VPU	Adreno VPU 554, decode 4k120, encode 4k60,concurrent 4k60/4k30 decode/encode	Adreno VPU 670, decode 4k240, encode 4k120, concurrent 4k120 decode/encode	Adreno VPU 665, decode 4k240, encode 4k120, concurrent 4k120 decode/encode
Audio	V66 512 KB L2 up to 1.459 GHz	V66 2 MB L2 up to 1.459 GHz	V66 2 MB L2 up to 1.459 GHz
Security	SPU230	SPU230	SPU250
Functional safety	Safety Element out of Context (SEooC) targeting assumed ASIL B use cases	Safety Element out of Context (SEooC) targeting assumed ASIL B use cases. Contains dedicated Safety Island (SAIL) with quad Cortex-R52 CPU configurable per pair	Safety Element out of Context (SEooC) targeting assumed ASIL B use cases. Contains dedicated Safety Manager sub-system, with lock step core
Junction temp	-40°C to +105°C	-40°C to +115°C	-40°C to +115°C
Display - DP	4-lane DisplayPort v1.4 shared with USB 3.1 Gen 2	4 x 4-lane embedded DisplayPort v1.4b	3 x 4-lane DisplayPort v1.4, 1 x shared with USB 3.1 Gen 2 4 x 4-lane embedded DisplayPort v1.4b
Display - DSI	DSI D-PHY v1.2 4-lane DSI0 4-lane DSI1	DSI D-PHY v1.2 DSI C-PHY v1.1 2 x 4-lane DSI	DSI D-PHY v1.2 DSI C-PHY v1.1 2 x 4-lane DSI
Camera – CSI	CSI-2 v1.3 4-lane CSI0 4-lane CSI1 4-lane CSI2 4-lane CSI3	CSI D-PHY v1.2 CSI C-PHY v1.1 4 x 4-lane CSI	CSI D-PHY v1.2 CSI C-PHY v1.1 4 x 4-lane CSI
CCI-I2C	x4	x8	x8
Audio – LS-I2S	4 x 2 data lanes each 1 x 4 data lanes each	9 x 2 data lanes each 1 x 4 data lanes each	9 x 2 data lanes each 1 x 4 data lanes each
Audio – HS-I2S	3 x 2 data lanes each, receive only	5 x 2 data lanes each, receive only	5 x 2 data lanes each, receive only
Audio – TDM/PCM	4 x 2 data lanes each 1 x 4 data lanes each	9 x 2 data lanes each 1 x 4 data lanes each	9 x 2 data lanes each 1 x 4 data lanes each
Storage – UFS	2 lane UFS 2.1 gear 3 rate A	1 x 2 lane UFS 3.1 gear 4 rate B	1 x 2 lane UFS 3.1 gear 4 rate B
PCIe	1-lane PCIe 3 (RC) 2-lane PCIe 3 (RC/EP)	1 x 2-lane PCIe 4 (RC/EP) 1 x 4-lane PCIe 4 (RC/EP)	1 x 1-lane PCIe 3 (RC/EP) 2 x 4-lane PCIe 3 (RC/EP)
Ethernet – RGMII/RMII	1 x with MDIO 1.8 V only	2 x SGMII up to 2.5 Gbps	2 x with MDIO 1.8 V or 2.5 V
USB	1 x USB 3.1 Gen 2 shared with DisplayPort 1 x USB 3.1 Gen 2	2 x USB3.1 Gen 2 1 x USB2.0	4 x USB3.1 Gen 2 1x shared with DisplayPort 2 x USB2.0
Functional safety	-	79 SAIL I/Os * 5 x SAIL QUP SE (UART/I2C/SPI-M/SPI-S) 3 x on-board thermal monitors 1 x RGMII/RMII with MDIO 1.8 V or 2.5 V Eight CAN-FD up to 12 Mbps 1 x Octal-SPI/Quad-SPI NOR (SAIL)	20 SM-GPIOs 1 x SPI – master 1 x SPI – slave 2 x I2C – master 2-lane UART – master 4 x clock monitors 44 x voltage monitors 3 x on-board thermal monitors
Miscellaneous SPI I 2 C UART GPIO	26 x QUP SE (GPIO + SSC) Master and slave Master Host 174 GPIOs	21 QUP SE (GPIO) Master and slave Master Multi-master Host 149 GPIOs	32 x QUP SE (GPIO+SSC) Master and slave Master Host 228 GPIOs
PMIC	20 x GPIOs 3 x AMUX	35 GPIOs 8 x AMUX	32 x GPIOs ，7 x AMUX

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8155/8255/8295参数对比

SoC Chipset Feature Comparison

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